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Dymola-based multi-parameters integrated optimization for high speed transfer system of LED chip sorter

Jie OUYANG, Bin LI, Shihua GONG

Frontiers of Mechanical Engineering 2013, Volume 8, Issue 2, Pages 118-126 doi: 10.1007/s11465-013-0253-y

Abstract:

To enhance the performance of high speed transfer system of LED chip sorting equipment, its controlparameters need to be well matching with the mechanical system.parameters optimization, modeling and simulation were included, i.e., a multi-domain model of transfer systemalso indicated that the optimized control parameters can well satisfy the requirements of transfer system

Keywords： LED chip sorter multi-domain modeling and simulation parameter optimization modelica language

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Co-design and Co-simulation on the System Level

Xu Hui,Wang Zuqiang,Wang Zhaojun

Strategic Study of CAE 2006, Volume 8, Issue 4, Pages 86-88

Abstract:

The article introduces the technology of co-design and co-simulation on the system level and the systemsimulation tool-Cocentric system studio.

Keywords： system on a chip software/hardware co-simulate system C CCSS (CoCentric system studio)

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Detection of solder bump defects on a flip chip using vibration analysis

Junchao LIU, Tielin SHI, Qi XIA, Guanglan LIAO

Frontiers of Mechanical Engineering 2012, Volume 7, Issue 1, Pages 29-37 doi: 10.1007/s11465-012-0314-7

Abstract: Solder bump defects on flip chips are difficult to detect, because the solder bumps are obscured by the chipvibration analysis is presented for detecting missing solder bumps, which is a typical defect in flip chipThe flip chip analytical model is revised by considering the influence of spring mass on mechanical energyof the system.This revised model is then applied to estimate the flip chip resonance frequencies.

Keywords： flip chip defect detection ultrasonic excitation vibration analysis

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System-level Pareto frontiers for on-chip thermoelectric coolers

Sevket U. YURUKER, Michael C. FISH, Zhi YANG, Nicholas BALDASARO, Philip BARLETTA, Avram BAR-COHEN, Bao YANG

Frontiers in Energy 2018, Volume 12, Issue 1, Pages 109-120 doi: 10.1007/s11708-018-0540-8

Abstract: continuous rise in heat dissipation of integrated circuits necessitates advanced thermal solutions to ensure systemThermoelectric coolers are among the most promising techniques for dealing with localized on-chip hotIt is found that when element thickness and electrical current are optimized for a given system architectureThis methodology also provides the possible system level Δ ’s that can be achieved for a range of heatof master curves were generated, which were then used to compose the Pareto frontier for any given system

Keywords： thermoelectric cooling thermal management optimization high flux electronics

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Research of MEMS and Development of One-chip RF - MEMS

Zhong Xianxin,Yu Wenge,Li Xiaoyi,Wu Zhengzhong,Liu Jixue,Chen Shuai,Shao Xiaoliang

Strategic Study of CAE 2004, Volume 6, Issue 7, Pages 21-25

Abstract:

Micro-electro-mechanical integration system, called microsystem for short is one of forefront technologiesdevices, double the function density, information density and interlinkage density of apparatus and systemsummarized, and then a proposition that MEMS technology is one of the ultimate resolutions for one-chipThe evolvement status about one-chip mechanical electronic integration microsystem for wireless communication

Keywords： microsystem integration one-chip wireless communication system

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Piezoelectric pump with flexible venous valves for active cell transmission

Frontiers of Mechanical Engineering 2022, Volume 17, Issue 4, doi: 10.1007/s11465-022-0712-4

Abstract: The development of organ-on-a-chip systems demands high requirements for adequate micro-pump performanceThe proposed pump can help to construct the circulating organ-on-a-chip system, and the simple structurethe micro-pump and providing a reference for the further study of active cell transport in organ-on-a-chip

Keywords： venous valve flexible venous valve cell transmission organ-on-a-chip system piezoelectric device

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Single-chip 3D electric field microsensor

Biyun LING, Yu WANG, Chunrong PENG, Bing LI, Zhaozhi CHU, Bin LI, Shanhong XIA

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4, Pages 581-590 doi: 10.1007/s11465-017-0454-x

Abstract:

This paper presents a single-chip 3D electric field microsensor, in which a sensing element is set

Keywords： electric field microsensor three-dimensional single-chip in-plane rotation

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Development of an electrorheological chip and conducting polymer based sensor

Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,

Frontiers of Mechanical Engineering 2009, Volume 4, Issue 4, Pages 472-472 doi: 10.1007/s11465-009-0077-y

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SIMULATION OF O-BLOWN CO-GASIFICATION OF WOOD CHIP AND POTATO PEEL FOR PRODUCING SYNGAS

Frontiers of Agricultural Science and Engineering 2023, Volume 10, Issue 3, Pages 448-457 doi: 10.15302/J-FASE-2023490

Abstract:

● Low-value biowaste including wood chip and potato peel was valorized

Keywords： Aspen Plus co-gasification potato peel syngas simulation waste reduction wood chip

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3D finite element prediction of chip flow, burr formation, and cutting forces in micro end-milling of

A. DAVOUDINEJAD, P. PARENTI, M. ANNONI

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 2, Pages 203-214 doi: 10.1007/s11465-017-0421-6

Abstract: simulations were performed under different cutting conditions to obtain realistic numerical predictions of chipnotable advantages, such as capability to easily handle any type of tool geometry and any side effect on chipThe proposed 3D FE model considers the effects of mill helix angle and cutting edge radius on the chip

Keywords： 3D finite element modeling micro end-milling cutting force chip formation burr formation

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Engineered Vasculature for Organ-on-a-Chip Systems Review

Abdellah Aazmi, Hongzhao Zhou, Yuting Li, Mengfei Yu, Xiaobin Xu, Yutong Wu, Liang Ma, Bin Zhang, Huayong Yang

Engineering 2022, Volume 9, Issue 2, Pages 131-147 doi: 10.1016/j.eng.2021.06.020

Abstract:

Organ-on-a-chip technology, a promising three-dimensional (3D) dynamic culture method, ensures accurateThe circulatory system, the most abundant organ in the human body, plays a crucial role in oxygen exchangeThus, it is essential to integrate the circulatory system into an organ-on-a-chip to recreate tissueThis review discusses the synergy between the vasculature and the emerging organ-on-a-chip technologyIn addition, we review the different steps of a vascularized organ-on-a-chip fabrication process, including

Keywords： Organ-on-a-chip Vasculature Bioprinting Tumor-on-a-chip

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Three-Dimensional Chip Imaging

Marcus Woo

Engineering 2020, Volume 6, Issue 5, Pages 485-486 doi: 10.1016/j.eng.2020.03.009

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Development of electrorheological chip and conducting polymer-based sensor

Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,

Frontiers of Mechanical Engineering 2009, Volume 4, Issue 4, Pages 393-396 doi: 10.1007/s11465-009-0043-8

Abstract: The developed ER chip worked as an actuator, and it was driven by different voltages and control frequenciesmonotonically when the frequency increases, owing to the time delay in the pressure buildup in the ER chip

Keywords： electrorheological (ER) fluids conducting polymer (CP) polydimethylsioxane (PDMS) driving frequency amplitude bubble counter

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Machine Learning Produces Superhuman Chip Designs

Robert Pollie,

Engineering 2022, Volume 10, Issue 3, Pages 7-9 doi: 10.1016/j.eng.2022.01.006

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Development of Microfabrication Techniques for Production of Analysis Chip

Wei Shoushui,Zhang Yulin,Cui Dafu

Strategic Study of CAE 2004, Volume 6, Issue 10, Pages 90-94

Abstract:

Fabrication of micro-channels is a key technique for production of analysis chip.Some available methods of microfabrication for production of analysis chip were proposed.

Keywords： analysis chip microfabrication μ-TAS